Qualcomm is reportedly working on its next-gen flagship mobile chipset, the Snapdragon 845. Successor to the existing Snapdragon 835 SoC, the new chipset is expected to be announced by the end of this year. The new chipset is expected to bring performance improvements along with battery life efficiency.
According to a leaked invite spotted on Weibo (via mysmartprice), the Snapdragon 845 SoC will be announced at the Snapdragon Technology Summit in Maui, Hawaii. The event is set to take place between December 4-8, and it is likely that the chipset will be announced on the very first day, the report states. 
The Snapdragon 835 SoC was unveiled at CES 2017 in January, whereas its successor is expected to be announced a month earlier. Rumors also claim that Samsung will be manufacturing the chipsets, and it already has dibs on the first production batch for the Galaxy S9 and Galaxy S9+ smartphones. 
Even as earlier rumors hinted that the new chipset will be made on 7nm process, the next-gen chipset is expected to be manufactured on the same 10nm FinFET process as the Snapdragon 835 SoC. However, instead of custom Kryo cores, the next-gen chipset is expected to see a shift to four ARM Cortex A75 cores, along with four Cortex A53 cores. In terms of graphics, the Snapdragon 845 SoC could be paired with Adreno 630 GPU. 
On the connectivity front, the Snapdragon 845 SoC is rumored to ship with X20 modem with support for download speeds up to 1.2Gbps. Qualcomm has also been focusing on its Spectra ISP for improved low-light photography, and camera with zero shutter lag. With competitors such as Huawei adding Artificial Intelligence in its Kirin chipsets, it wouldn’t be a surprise if Qualcomm also does the same with the new Snapdragon 845 SoC. Rest of the details are scarce at the moment, but we are not likely to see devices running on the Snapdragon 845 SoC until first half of 2018.